Ekaterina Al-Tavil

First steps towards the 3D integration of superconducting devices with semiconducting quantum dots have been taken. For this purpose, a process for realizing a metallic stack allowing galvanic contact between two chips via indium bump bonds has been established. The benefits of this technology include separate fabrication optimization, versatility on the semiconducting side, modular approach and scalability. Making using circuit QED techniques, we present an implementation for transmon-assisted double quantum dot charge sensing. Using this technique, remote and scalable probing of DQDs would be possible.